Internet Data Sheet
HYS64T[32/64/128]xxxEDL–[25F/…/3.7](–)B2
Small Outlined DDR2 SDRAM Modules
Product Type1)
PC2–4200
Compliance Code2)
Description
SDRAM
Technology
HYS64T32000EDL–3.7–B2
HYS64T32900EDL–3.7–B2
256 MB 1R × 16 PC2–4200S–444–12–C0
512 MB 2R × 16 PC2–4200S–444–12–A0
1 GB 2R × 8 PC2-4200S–444–12–E0
1 Rank, Non-ECC
2 Rank, Non-ECC
2 Rank, Non-ECC
512 Mbit (×16)
512 Mbit (×16)
512 Mbit (×8)
HYS64T64020EDL–3.7–B2
HYS64T64920EDL–3.7–B2
HYS64T128021EDL–3.7B2
HYS64T128921EDL–3.7B2
1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS64T64020EDL–3.7–B2, indicating
Rev. “B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of
this data sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200S–444–12–A0”, where
4200S means Small Outlined Unbuffered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address
Strobe (CAS) latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD
Revision 1.2 and produced on the Raw Card “A”.
TABLE 3
Address Format
DIMM
Density
Module
Organization
Memory
Ranks
ECC/
Non-ECC
# of SDRAMs # of row/bank/column
bits
Raw
Card
256 MByte
512 MByte
1 GByte
32M × 64
64M × 64
128M × 64
1
2
2
Non-ECC
Non-ECC
Non-ECC
4
13/2/10
13/2/10
14/2/10
C
A
E
8
16
TABLE 4
Components on Modules
DRAM Organisation
32M × 16
Product Type1)2)
DRAM Components2)
DRAM Density
HYS64T32000EDL
HYS64T32900EDL
HYB18T512160B2F
512 Mbit
HYS64T64020EDL
HYS64T64920EDL
HYB18T512160B2F
HYB18T512800B2F
512 Mbit
512 Mbit
32M × 16
64M × 8
HYS64T128021EDL
HYS64T128921EDL
1) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
2) Green Product
Rev. 1.1, 2007-01
5
08212006-PKYN-2H1B
QIMONDA [ QIMONDA AG ]
