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HYB18TC1G800AF 参数 Datasheet PDF下载

HYB18TC1G800AF图片预览
型号: HYB18TC1G800AF
PDF下载: 下载PDF文件 查看货源
内容描述: 1千兆位DDR2 SDRAM [1-Gbit DDR2 SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 54 页 / 3010 K
品牌: QIMONDA [ QIMONDA AG ]
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Internet Data Sheet  
HYB18TC1G[80/16]0AF  
1-Gbit DDR2 SDRAM  
12) The tHZ, tRPST and tLZ, tRPRE parameters are referenced to a specific voltage level, which specify when the device output is no longer driving  
(tHZ, tRPST), or begins driving (tLZ, tRPRE). tHZ and tLZ transitions occur in the same access time windows as valid data transitions.These  
parameters are verified by design and characterization, but not subject to production test.  
13) The Auto-Refresh command interval has be reduced to 3.9 µs when operating the DDR2 DRAM in a temperature range between 85 °C  
and 95 °C.  
14) 0 °CTCASE 85 °C  
15) 85 °C < TCASE 95 °C  
16) A maximum of eight Auto-Refresh commands can be posted to any given DDR2 SDRAM device.  
17) The tRRD timing parameter depends on the page size of the DRAM organization. See Table 4 “Ordering Information for RoHS compliant  
products” on Page 5.  
18) The maximum limit for the tWPST parameter is not a device limit. The device operates with a greater value for this parameter, but system  
performance (bus turnaround) degrades accordingly.  
19) WR must be programmed to fulfill the minimum requirement for the tWR timing parameter, where WRMIN[cycles] = tWR(ns)/tCK(ns) rounded  
up to the next integer value. tDAL = WR + (tRP/tCK). For each of the terms, if not already an integer, round to the next highest integer. tCK  
refers to the application clock period. WR refers to the WR parameter stored in the MRS.  
20) Minimum tWTR is two clocks when operating the DDR2-SDRAM at frequencies ≤ 200 ΜΗz.  
21) User can choose two different active power-down modes for additional power saving via MRS address bit A12. In “standard active power-  
down mode” (MR, A12 = “0”) a fast power-down exit timing tXARD can be used. In “low active power-down mode” (MR, A12 =”1”) a slow  
power-down exit timing tXARDS has to be satisfied.  
TABLE 42  
Timing Parameter by Speed Grade - DDR2-400  
Parameter  
Symbol  
DDR2–400  
Unit  
Note  
1)2)3)4)5)6)  
Min.  
Max.  
DQ output access time from CK / CK  
CAS A to CAS B command period  
CK, CK high-level width  
tAC  
–600  
2
+600  
ps  
tCCD  
tCH  
tCKE  
tCL  
tCK  
tCK  
tCK  
tCK  
tCK  
0.45  
3
0.55  
CKE minimum high and low pulse width  
CK, CK low-level width  
0.45  
WR + tRP  
0.55  
7)21)  
8)  
Auto-Precharge write recovery + precharge  
time  
tDAL  
Minimum time clocks remain ON after CKE  
asynchronously drops LOW  
tDELAY  
tIS + tCK + tIH  
275  
ns  
ps  
ps  
9)  
DQ and DM input hold time (differential data  
strobe)  
tDH(base)  
10)  
DQ and DM input hold time (single ended data tDH1(base)  
–25  
strobe)  
DQ and DM input pulse width (each input)  
DQS output access time from CK / CK  
tDIPW  
0.35  
–500  
0.35  
tCK  
ps  
tCK  
ps  
tDQSCK  
+500  
DQS input low (high) pulse width (write cycle) tDQSL,H  
10)  
DQS-DQ skew (for DQS & associated DQ  
signals)  
tDQSQ  
350  
Write command to 1st DQS latching transition tDQSS  
– 0.25  
150  
+ 0.25  
tCK  
10)  
10)  
DQ and DM input setup time (differential data  
strobe)  
t
DS(base)  
ps  
DQ and DM input setup time (single ended  
data strobe)  
t
DS1(base)  
–25  
ps  
Rev. 1.11, 2006-09  
44  
03292006-PJAE-UQLG  
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