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AND2307 参数 Datasheet PDF下载

AND2307图片预览
型号: AND2307
PDF下载: 下载PDF文件 查看货源
内容描述: LED显示屏 [LED Displays]
分类和应用:
文件页数/大小: 2 页 / 55 K
品牌: PURDY [ PURDY ELECTRONICS CORPORATION ]
 浏览型号AND2307的Datasheet PDF文件第2页  
O
PTOELECTRONICS
Unit: mm
47.76
41.5
3.5 min.
A
28.5
F
G
28.5
E
D
DP
5.5ø
12.0
0.5
1.0 All Pin
No. 1
5
E
D
C
B
A
F
G
DP
1
LED Displays
Product specifications contained herein may be changed without prior
notice. It is therefore advisable to contact Purdy Electronics before
proceeding with the design of equipment incorporating this product.
B
60.0
AND-2307 Series
25.75
C
GaAsP/GaP–Red; GaP–Green
7 Segment, Large Size; 2.3 Inch
Features
• Large size—7 segment displays
• Available in red or green
• Suitable for large size displays for distance viewing;
across-the-building status displays
• Available in both common cathode and common anode
RoHS Compliant
70.0
No. 5
5
2.54 X 4 = 10.16
Description
Size
2.3 inch
2.3 inch
Number
of Digits
1
1
Common
Cathode
AND-2307SCL
AND-2307GCL
Color
Anode
Display
Red
Green
Face
Red
Gray
Number
of Pins
10
10
AND-2307SAL
AND-2307GAL
Absolute Maximum Ratings (T = 25°C)
Characteristics
DC Forward Current/Segment
Reverse Voltage/Segment
Operating Temperature Range
Storage Temperature Range
Symbol
I
F
(DC)/SEG
V
R
T
Opr
T
Stg
Rating
30
3 (Red), 5 (Green)
-25 to 85
-25 to 100
Unit
mA
V
°C
°C
Electro-Optical Characteristics (T = 25°C)
Characteristics
Forward Voltage/Segment
Forward Voltage/D.P.
Reverse Current
Luminous Intensity
Per Segment
Peak Emission
Wavelength
Spectral Line
Half Width
Red
Green
Red
Green
Red
Green
Symbol
V
F
V
F
I
R
I
V
I
V
λ
P
λ
P
∆λ
∆λ
Test Condition
I
F
= 20 mA
I
F
= 10 mA
V
R
= 3 (Red), 5 (Green)
I
F
= 10 mA
I
F
= 10 mA
I
F
= 10 mA
I
F
= 10 mA
I
F
= 10 mA
I
F
= 10 mA
Minimum
4.7
4.1
Typical
8.4
4.2
7.8
6.8
635
567
40
30
Maximum
12.0
6.0
100
Unit
V
V
µA
mcd
mcd
nm
nm
nm
nm
Precaution
Please be careful of the following:
1. Soldering temperature: 260°C max; Soldering time: 3 sec. max; Soldering portion of lead: up to 2 mm from the body of the device.
2. The lead can be formed up to 5 mm from the body of the device without forming stress. Soldering should be performed after the lead
forming.
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085
Tel: 408.523.8200 • Fax: 408.733.1287 • email@purdyelectronics.com • www.purdyelectronics.com
7/18/07