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AND-8010SALB 参数 Datasheet PDF下载

AND-8010SALB图片预览
型号: AND-8010SALB
PDF下载: 下载PDF文件 查看货源
内容描述: [Optoelectronic Device]
分类和应用:
文件页数/大小: 2 页 / 44 K
品牌: PURDY [ PURDY ELECTRONICS CORPORATION ]
 浏览型号AND-8010SALB的Datasheet PDF文件第2页  
O
PTOELECTRONICS
Unit: mm
11.0
8.5
Product specifications contained herein may be changed without prior
notice. It is therefore advisable to contact Purdy Electronics before
proceeding with the design of equipment incorporating this product.
.2.54
1+
A1
A2
+18
F H J K B
G
M
AND-8010-B Series
GaAsP/GaP–Red; GaP–Green
16 Segment, Single Digit, 0.8 Inch
Features
• 16 segment alphanumeric displays
RoHS Compliant
• 0.8 inch character height
• Available in red or green
• Suitable for computer peripherals and terminal displays for
viewing at a distance
• Available in both common cathode and common anode
20.32 27.69
E R P N C
D2
D1
DP
+10
2.2
9+
20.0
3.5
Min.
15.24
(0.5 ) all pins
Description
Size
0.8 inch
0.8 inch
Number
of Digits
1
1
Common
Cathode
AND-8010SCLB
AND-8010GCLB
Color
Anode
Display
Red
Green
Face
Red
Gray
Number
of Pins
18
18
AND-8010SALB
AND-8010GALB
Absolute Maximum Ratings (T = 25°C)
Characteristics
DC Forward Current/Segment
Pulse Forward Current/Segment
(1us Pulse - .3% Duty Cycle)
Reverse Voltage/Segment
Operating Temperature Range
Storage Temperature Range
Symbol
I
F
(DC)/SEG
I
FP
/SEG
V
R
T
Opr
T
Stg
Rating
30
100
3 (Red), 5 (Green)
-25 to 85
-25 to 100
Unit
mA
mA
V
°C
°C
Electro-Optical Characteristics (T = 25°C)
Characteristics
Forward Voltage
Reverse Current
Luminous Intensity
Per Segment
Peak Emission
Wavelength
Spectral Line
Half Width
Red
Green
Red
Green
Red
Green
Symbol
V
F
I
R
I
V
λ
P
∆λ
Test Condition
I
F
= 10 mA
V
R
= 3 (Red),5 (Green)
I
F
= 10 mA
Minimum
2.3
2.0
Typical
2.1
3.8
3.3
635
567
40
30
Maximum
3.0
100
Unit
V
µA
mcd
nm
nm
I
F
= 10 mA
I
F
= 10 mA
Precaution
Please be careful of the following:
1. Soldering temperature: 260°C max; Soldering time: 3 sec. max; Soldering portion of lead: up to 2 mm from the body of the device.
2. The lead can be formed up to 5 mm from the body of the device without forming stress. Soldering should be performed after the lead
forming.
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085
Tel: 408.523.8200 • Fax: 408.733.1287 • email@purdyelectronics.com • www.purdyelectronics.com
6/14/07