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LCD Driver IC
PT6584
Symbol
A
Min.
-
Nom.
Max.
3.15
0.25
2.90
0.45
-
A1
A2
b
0.00
2.50
0.29
-
2.70
-
D
23.20 BSC.
D1
E
20.00 BSC.
17.20 BSC.
E1
e
14.00 BSC.
0.80 BSC.
c
0.11
0.11
0.73
-
0.23
0.19
1.03
c1
L
0.15
0.88
L1
S
1.60 BSC.
0.20
0.13
0.13
0o
0o
5o
-
-
-
-
-
-
-
-
-
R1
R2
θ
0.30
7o
-
θ1
θ2
θ3
16o
16o
5o
Notes:
1. All dimensioning and tolerancing conform to ASME Y14.5M-1994.
2. Datum Plane H is located at the bottom of the mold parting line coincident with where the lead exits
the body.
3. Datums A-B and D to be determined at Datum Plane H.
4. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side.
Dimensions D1 and E1 do not include mismatch and are determined at the datum plane H.
5. Details of Pin 1 identifier are optional but must be located within the zone indicated.
6. Regardless of the relative size of the upper and lower body sections, Dimensions D1 and E1 are
determined at the largest feature of the body exclusive of mold flash and gate burrs, but including
any mismatch between the upper and lower section of the molded body.
7. Controlling Dimension: Millimeters
8. Dimension b does not include dambar protrusion. The dambar protrusion(s) shall not cause the
lead width to exceed b maximum by more than 0.08 mm. dambar cannot be located on the lower
radius or the lead foot.
9. N = No. of leads (N=80)
10. A1 is defined as the distance from the seating plane to the lowest point of the package body.
11. Please refer to JEDEC MS-022 Variation GB-2.
JEDEC is the trademark of the JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
PT6584 V1.1
- 40 -
August, 2006
PTC [ PRINCETON TECHNOLOGY CORP ]
