PE35400
Divide-by-4 Prescaler
Die Mechanical Specifications
This section provides the die mechanical specifications for the PE35400.
Table 5 • Mechanical Specifications for PE35400
Parameter
Min
Typ
Max
Unit
Condition
Including excess sapphire, max
tolerance = –20/+30 µm
Die size, singulated (x,y)
866 × 716
180
886 × 736
916 × 766
220
µm
Wafer thickness
Wafer size
200
150
µm
mm
Table 6 • Pad Coordinates for PE35400(*)
Figure 13 • Pad Layout for PE35400(1)(2)
Pad Opening
Size (µm)
Pad Center (µm)
Pad Pad
No. Name
8
GND
7
1
RBIAS
X
Y
X
Y
VBYPS
VBYPS
VBPYS
RFIN
1
2
3
4
5
6
7
8
–303
–303
–303
68
198
–3
160
160
100
290
100
130
130
290
180
180
100
130
190
190
130
130
6
VDD
2
–208
–243
–193
40
VBYPS
GND
5
RFOUT
333
318
318
14
3
RFOUT
4
RFIN
VDD
RBIAS
GND
GND
Die ID
243
243
886 μm (−20 / +30 μm)
Notes:
1) Drawings are not drawn to scale.
Note: * All pad locations originate from the die center and refer to the
2) Singulated die size shown, pad side up.
center of the pad.
DOC-64872-2 – (10/2015)
Page 11
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