NO
6
Item
Specification
Judge Level
The shape of modeling is deformed by touching.
Insufficient epoxy: Circuit or pad of IC is visible
Excessive epoxy: Diameter of modeling is > 20mm
or height is > 2.5mm
N.G. Major
N.G. Minor
Appearance of
molding
N.G. Minor
A=( L + W ) ╱ 2
The diameter of pinhole in modeling, A is > 0.2mm.
The folding angle of frame must be > 45°+ 10°
The area of stripped electroplate in top-view of
frame, A is > 1.0mm.
N.G. Minor
N.G. Minor
Appearance of
frame
N.G. Minor
N.G. Minor
N.G. Minor
7
8
Rust or crack is (Top view only)
A=( L + W ) ╱ 2
The scratched width of frame is > 0.06mm.
(Top view only)
The color of backlight is nonconforming
Backlight can’t work normally.
N.G. Major
N.G. Major
N.G. Major
Electrical
characteristic of
backlight
The LED lamp can’t work normally
The unsoldering area of pin for backlight,
A is > 1/2 solder joint area.
N.G. Minor
A=( L + W ) ╱ 2
The height of solder pin for backlight is > 2.0mm
The mark or polarity of component is unidentifiable.
The height between bottom of component and
surface of the PCB is floating > 0.7mm
D > 1/4W
N.G. Minor
N.G. Minor
N.G. Minor
N.G. Minor
N.G. Minor
W
D
Assembly parts
10
D’
Pad
A=( L + W ) ╱ 2
End solder joint width, D’ is > 50% width of
component termination or width of pad
Side overhang, D is > 25% width of component
termination.
N.G. Minor
N.G. Minor
N.G. Minor
Component is cracked, deformed, and burned, etc.
The polarity of component is placed in inverse
direction.
Maximum fillet height of solder extends onto the
component body or minimum fillet height
is < 0.5mm.
N.G. Minor
PE240128WRF-001-HQ VER.0
Page23
POWERTIP [ POWERTIP TECHNOLOGY ]
