TOP252-262
SMD-8C
Notes:
⊕ D S .004 (.10)
.046 .060 .060 .046
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
3. Pin locations start with Pin 1,
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 3 is omitted.
4. Minimum metal to metal
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
5. Lead width measured at
package body.
-E-
.080
.086
.186
.286
.372 (9.45)
.388 (9.86)
.240 (6.10)
.260 (6.60)
.420
.010 (.25)
⊕ E S
Pin 1
Pin 1
.137 (3.48)
MINIMUM
Solder Pad Dimensions
.100 (2.54) (BSC)
6. D and E are referenced
datums on the package
body.
.367 (9.32)
.387 (9.83)
-D-
.057 (1.45)
.068 (1.73)
(NOTE 5)
.125 (3.18)
.145 (3.68)
.004 (.10)
.032 (.81)
.037 (.94)
.048 (1.22)
.053 (1.35)
°
°
.009 (.23)
0 - 8
.036 (0.91)
.044 (1.12)
.004 (.10)
.012 (.30)
G08C
PI-4015-013106
45
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Rev. F 01/09
POWERINT [ Power Integrations ]
