TNY274-280
50
1.2
1.0
Scaling Factors:
TNY274 1.0
TNY275 1.5
TNY276 2.0
TNY277 3.5
TNY278 5.5
TNY279 7.3
TNY280 11
40
0.8
0.6
30
20
10
0
0.4
0.2
0
-50 -25
0
25 50 75 100 125
0
200
400
600
Junction Temperature (°C)
DRAIN Voltage (V)
Figure 27. Undervoltage Threshold vs. Temperature.
Figure 26. Drain Capacitance Power.
DIP-8C
⊕D S .004 (.10)
Notes:
-E-
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
.240 (6.10)
.260 (6.60)
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
Pin 1
-D-
.367 (9.32)
.387 (9.83)
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
.057 (1.45)
.068 (1.73)
(NOTE 6)
.125 (3.18)
.145 (3.68)
.015 (.38)
MINIMUM
-T-
SEATING
PLANE
.008 (.20)
.015 (.38)
.120 (3.05)
.140 (3.56)
.300 (7.62) BSC
(NOTE 7)
.100 (2.54) BSC
.048 (1.22)
.053 (1.35)
.137 (3.48)
MINIMUM
P08C
.300 (7.62)
.390 (9.91)
.014 (.36)
.022 (.56)
⊕T E D S .010 (.25) M
PI-3933-100504
20
Rev. I 01/09
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