TNY253/254/255
SMD-8
D S .004 (.10)
Heat Sink is 2 oz. Copper
As Big As Possible
DIM
inches
mm
8
5
-E-
A
B
C
G
H
0.370-0.385
0.245-0.255
0.125-0.135
0.004-0.012
0.036-0.044
9.40-9.78
6.22-6.48
3.18-3.43
0.10-0.30
0.91-1.12
.420
P
B
J1 0.060 (NOM) 1.52 (NOM)
.046
.060 .046
.060
J2
J3
J4
K
0.048-0.053
0.032-0.037
0.007-0.011
0.010-0.012
0.100 BSC
0.030 (MIN)
0.372-0.388
0-8°
1.22-1.35
0.81-0.94
0.18-0.28
0.25-0.30
2.54 BSC
0.76 (MIN)
9.45-9.86
0-8°
.080
Pin 1
1
4
L
L
.086
.186
.286
M
P
A
-D-
-F-
Solder Pad Dimensions
α
M
J1
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB (issue B, 7/85)
except for lead shape and size.
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
flash or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on
any side.
C
K
.004 (.10)
J3
J4
.010 (.25) M A S
α
G
G08A
4. D, E and F are reference datums on the
H
J2
molded body.
PI-2077-042601
C
16
7/01
POWERINT [ Power Integrations ]
