LinkSwitch-HP
eDIP-12B (V Package)
0.004 [0.10] C A
2
0.325 [8.26]
Seating Plane
C
0.400 [10.16]
0.016 [0.41]
0.011 [0.28]
Pin #1 I.D.
(Laser Marked)
Max.
11×
A
10
0.010 [0.25] Ref.
0.059 [1.50]
0.120 [3.05]
Ref.
6
Ref, typ.
2X
6
1
1
2
3
4
0.004 [0.10] C B
7
0.412 [10.46]
Ref.
2
0.400 [10.16]
8
0.225 [5.72]
0.350 [8.89]
0.306 [7.77]
Ref.
0.059 [1.50]
Ref, typ.
0.436 [11.08]
0.406 [10.32]
Max.
10
B
12 11 10
9
8
7
7
12
3
11×
4
0.023 [0.58]
0.018 [0.46]
Detail A
°
°
5 ± 4
TOP VIEW
0.104 [2.65] Ref.
0.010 [0.25] M C A B
BOTTOM VIEW
END VIEW
0.092 [2.34]
0.086 [2.18]
0.356 [9.04]
Ref.
0.019 [0.48]
Ref.
0.049 [1.23]
0.046 [1.16]
0.022 [0.56]
Ref.
0.192 [4.87]
Ref.
H
0.031 [0.80]
0.028 [0.72]
0.020 [0.51]
Ref.
0.070 [1.78]
0.028 [0.71]
Ref.
Notes:
SIDE VIEW
DETAIL A (Scale = 9X)
1. Dimensioning and tolerancing per
ASME Y14.5M-1994.
2. Dimensions noted are determined at the outer-
most extremes of the plastic body exclusive of
mold flash, tie bar burrs, gate burrs, and interlead
flash, but including any mismatch between the
top and bottom of the plastic body. Maximum
mold protrusion is 0.007 [0.18] per side.
3. Dimensions noted are inclusive of plating
thickness.
Mounting
Hole Pattern
Dimensions
0.07 [1.78]
0.03 [0.76]
4. Does not include inter-lead flash or protrusions.
5. Controlling dimensions in inches [mm].
6. Datums A and B to be determined at Datum H.
7. Measured with the leads constrained to be
perpendicular to Datum C.
0.400 [10.16]
8. Measured with the leads unconstrained.
9. Lead numbering per JEDEC SPP-012.
10. Exposed pad is nominally located at the center-
line of Datums A and B. “Max” dimensions
Drill Hole
Round Pad 0.05 [1.27]
Solder Mask 0.056 [1.42]
0.03 [0.76]
noted include both size and positional tolerances.
PI-5556a-100311
22
Rev. E 06/15
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