LNK501
SMD-8B
Notes:
D S .004 (.10)
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
3. Pin locations start with Pin 1,
and continue counter-clock
Pin 8 when viewed from the
top. Pin 6 is omitted.
4. Minimum metal to metal
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
5. Lead width measured at
package body.
6. D and E are referenced
datums on the package
body.
-E-
.420
.372 (9.45)
.388 (9.86)
.245 (6.22)
.255 (6.48)
.046 .060 .060 .046
.010 (.25)
E S
.080
Pin 1
Pin 1
-D-
.086
.186
.100 (2.54) (BSC)
.286
Solder Pad Dimensions
.375 (9.53)
.385 (9.78)
.057 (1.45)
.063 (1.60)
(NOTE 5)
.128 (3.25)
.132 (3.35)
.004 (.10)
.036 (0.91)
.044 (1.12)
.032 (.81)
.037 (.94)
.048 (1.22)
.053 (1.35)
°
°
.009 (.23)
0 - 8
.004 (.10)
.012 (.30)
G08B
PI-2546-081601
F
9/02
18
POWERINT [ Power Integrations ]
