LNK302/304-306
SO-8C
0.10 (0.004)
A-B
2X
C
2
DETAIL A
B
4
4.90 (0.193) BSC
A
4
D
8
5
GAUGE
PLANE
SEATING
PLANE
3.90 (0.154) BSC
6.00 (0.236) BSC
2
0 - 8o
C
0.25 (0.010)
BSC
1.04 (0.041) REF
0.10 (0.004)
C D
0.40 (0.016)
1.27 (0.050)
2X
1
4
Pin 1 ID
0.20 (0.008) C
2X
7X 0.31 - 0.51 (0.012 - 0.020)
0.25 (0.010)
1.27 (0.050) BSC
M
C A-B D
1.25 - 1.65
(0.049 - 0.065)
1.35 (0.053)
1.75 (0.069)
DETAIL A
H
0.10 (0.004)
0.25 (0.010)
0.10 (0.004)
C
7X
SEATING PLANE
0.17 (0.007)
0.25 (0.010)
C
Reference
Solder Pad
Dimensions
+
Notes:
1. JEDEC reference: MS-012.
2. Package outline exclusive of mold flash and metal burr.
3. Package outline inclusive of plating thickness.
4. Datums A and B to be determined at datum plane H.
2.00 (0.079)
4.90 (0.193)
5. Controlling dimensions are in millimeters. Inch dimensions
are shown in parenthesis. Angles in degrees.
+
+
+
1.27 (0.050)
0.60 (0.024)
D07C
PI-4526-040207
2-16
16
Rev. I 11/08
POWERINT [ Power Integrations ]
