DPA422-426
PDIP-8 (P Package)
D S .004 (.10)
DIM
Inches
mm
8
5
-E-
A
B
C
G
H
J1
J2
K
L
M
N
P
Q
0.367-0.387
0.240-0.260
0.125-0.145
0.015-0.040
0.120-0.140
0.057-0.068
0.014-0.022
0.008-0.015
0.100 BSC
0.030 (MIN)
0.300-0.320
0.300-0.390
0.300 BSC
9.32-9.83
6.10-6.60
3.18-3.68
0.38-1.02
3.05-3.56
1.45-1.73
0.36-0.56
0.20-0.38
2.54 BSC
0.76 (MIN)
7.62-8.13
7.62-9.91
7.62 BSC
B
1
4
A
-D-
-F-
M
J1
N
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB for standard dual in-line
(DIP) package .300 inch row spacing (PLASTIC)
8 leads (issue B, 7/85).
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold flash
or other protrusions. Mold flash or protrusions
shall not exceed .006 (.15) on any side.
4. D, E and F are reference datums on the molded
body.
C
H
K
G
Q
P
J2
P08A
L
PI-2076-040110
SMD-8 (G Package)
D S .004 (.10)
DIM
Inches
mm
9.32-9.83
8
5
-E-
A
B
C
G
H
J1
J2
J3
J4
K
0.367-0.387
0.240-0.260
0.125-0.145
0.004-0.012
0.036-0.044
0.057-0.068
0.048-0.053
0.032-0.037
0.007-0.011
0.010-0.012
0.100 BSC
0.030 (MIN)
0.372-0.388
0-8°
6.10-6.60
3.18-3.68
0.10-0.30
0.91-1.12
1.45-1.73
1.22-1.35
0.81-0.94
0.18-0.28
0.25-0.30
2.54 BSC
0.76 (MIN)
9.45-9.86
0-8°
.420
P
B
.046
.060 .046
.060
.080
L
M
P
Pin 1
1
4
L
.086
.186
.286
α
A
-D-
Solder Pad Dimensions
M
J1
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB (issue B, 7/85)
except for lead shape and size.
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
flash or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on
any side.
C
K
-F-
.004 (.10)
H
J3
J4
.010 (.25) M A S
α
G
4. D, E and F are reference datums on the
molded body.
G08A
J2
PI-2077-040110
31
www.powerint.com
Rev. T 12/12
POWERINT [ Power Integrations ]
