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DPA426G 参数 Datasheet PDF下载

DPA426G图片预览
型号: DPA426G
PDF下载: 下载PDF文件 查看货源
内容描述: 高度集成DC -DC转换器IC用于以太网供电和电信应用 [Highly Integrated DC-DC Converter ICs for Power over Ethernet & Telecom Applications]
分类和应用: 转换器电信以太网
文件页数/大小: 34 页 / 2832 K
品牌: POWERINT [ Power Integrations ]
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DPA422-426  
give little or no improvement in efficiency due to the  
improvement in conduction losses being negated by larger  
device switching losses. Figure 50 provides information on  
switching losses. This together with conduction loss  
calculations give an estimate of device dissipation.  
overload power and minimizes the size of the secondary  
components.  
No-load and Standby Consumption  
Cycle skipping operation at light or no-load can significantly  
reduce power loss. In addition this operating mode ensures  
that the output maintains regulation even without an external  
minimum load. However, if cycle skipping is undesirable in a  
particular application, it can be avoided by adding sufficient  
pre-load.  
Primary Clamp  
A primary clamp network is recommended to keep the peak  
DRAIN voltage due to primary leakage inductance to below the  
BVDSS specification. A Zener diode combined with a small value  
capacitor connected across the primary winding is a low cost  
and low part count implementation.  
DPA-Switch Layout Considerations  
Output Rectification  
The DPA-Switch can operate with large DRAIN current, the  
following guidelines should be carefully followed.  
Rectification of the secondary is typically performed using  
Schottky diodes or synchronous rectification. Schottky diodes  
are selected for peak inverse voltage, output current, forward  
drop and thermal conditions. Synchronous rectification  
requires the additional complication of providing gate drive. The  
specified line undervoltage and line overvoltage thresholds of  
DPA-Switch simplifies deriving gate drive directly from the  
transformer secondary winding for many applications. The  
turns ratio of the transformer together with the under/over-  
voltage thresholds defines the minimum and maximum gate  
voltages, removing the need for Zeners to clamp the gate  
voltage.  
Primary Side Connections  
The tab of DPA-Switch R package is the intended return path  
for the high switching currents. Therefore, the tab should be  
connected by wide, low impedance traces back to the input  
decoupling capacitor. The SOURCE pin should not be used to  
return the power currents; incorrect operation of the device may  
result. The SOURCE is only intended as a signal ground. The  
device tab (SOURCE) is the correct connection for high current  
with the R package.  
The CONTROL pin bypass capacitor should be located as  
close as possible to the SOURCE and CONTROL pins and its  
SOURCE connection trace should not be shared by the main  
MOSFET switching currents. All SOURCE pin referenced  
components connected to the LINE-SENSE or EXTERNAL  
CURRENT LIMIT pins should also be located closely between  
their respective pin and SOURCE. Once again, the SOURCE  
connection trace of these components should not be shared by  
the main MOSFET switching currents. It is critical that the tab  
(SOURCE) power switching currents are returned to the input  
capacitor through a separate trace that is not shared by the  
components connected to CONTROL, LINE-SENSE or  
EXTERNAL CURRENT LIMIT pins.  
Soft-Start  
Generally a power supply experiences maximum stress at start-  
up before the feedback loop achieves regulation. For a period  
of 5 ms the on-chip soft-start linearly increases the duty cycle  
from zero to the default DCMAX at turn-on. In addition, the  
primary current limit increases from 85% to 100% over the  
same period. This causes the output voltage to rise in an  
orderly manner allowing time for the feedback loop to take  
control of the duty cycle. This integrated soft-start reduces the  
stress on the DPA-Switch MOSFET, clamp circuit and output  
diode(s), and helps prevent transformer saturation during start-  
up. Also, soft-start limits the amount of output voltage  
overshoot, and in many applications eliminates the need for a  
soft-finish capacitor. If necessary, to remove output overshoot,  
a soft-finish capacitor may be added to the secondary  
reference.  
Any traces to the L or X pins should be kept as short as  
possible and away from the DRAIN trace to prevent noise  
coupling. LINE-SENSE resistor (R1 in Figure 25) should be  
located close to the LINE-SENSE pin to minimize the trace  
length on the LINE-SENSE pin side.  
Switching Frequency  
The FREQUENCY pin of DPA-Switch offers a switching  
frequency option of 400 kHz or 300 kHz. Operating at 300 kHz  
will increase the amount of magnetization energy stored in the  
transformer. This is ideal for applications using synchronous  
rectification driven directly from the transformer secondary  
where this energy can be used to drive the catch MOSFET gate.  
In addition to the CONTROL pin capacitor (C6 in Figure 25), a  
high frequency bypass capacitor in parallel is recommended as  
close as possible between SOURCE and CONTROL pins for  
better noise immunity. The feedback optocoupler output  
should also be located close to the CONTROL and SOURCE  
pins of DPA-Switch.  
Transformer Design  
It is recommended that the forward converter transformer be  
designed for maximum operating flux swing of 1500 Gauss and  
a peak flux density of 3500 Gauss. When operating at the  
maximum current limit of the selected DPA-Switch (during  
overload conditions), neither magnetic component (transformer  
and output inductor) should be allowed to saturate. When a  
larger device than necessary has been selected, reducing the  
internal current limit close to the operating peak current limits  
Heat Sinking  
To maximize heat sinking of the DPA-Switch R or G package  
and the other power components, special thermally conductive  
PC board material (aluminum clad PC board) is recommended.  
This has an aluminum sheet bonded to the PC board during the  
manufacturing process to provide heat sinking directly and  
allow the attachment of an external heat sink. If normal PC  
board material is used (such as FR4), providing copper areas on  
18  
Rev. T 12/12  
www.powerint.com  
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