TISPPBL1D, TISPPBL1P, TISPPBL2D, TISPPBL2P
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
FOR ERICSSON COMPONENTS SLICS
AUGUST 1997 - REVISED DECEMBER 1999
MECHANICAL DATA
P008
plastic dual-in-line package
This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions The package is intended for
insertion in mounting-hole rows on 7,62 (0.300) centres. Once the leads are compressed and inserted,
sufficient tension is provided to secure the package in the board during soldering. Leads require no additional
cleaning or processing when used in soldered assembly.
P008
Designation per JEDEC Std 30:
PDIP-T8
10,2 (0.400) MAX
7 6
8
5
Index
Dot
C
C
L
L
7,87 (0.310)
7,37 (0.290)
T.P.
1
2
3
4
6,60 (0.260)
6,10 (0.240)
1,78 (0.070) MAX
4 Places
5,08 (0.200)
MAX
Seating
Plane
105°
90°
8 Places
0,51 (0.020)
MIN
3,17 (0.125)
MIN
0,36 (0.014)
0,20 (0.008)
8 Places
2,54 (0.100) T.P.
6 Places
(see Note A)
0,533 (0.021)
0,381 (0.015)
8 Places
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
NOTE A: Each pin centerline is located within 0,25 (0.010) of its true longitudinal position
MDXXABA
P R O D U C T
I N F O R M A T I O N
18
POINN [ POWER INNOVATIONS LTD ]
