Released
PMC-Sierra, Inc.
PM9311/2/3/5 ETT1™ CHIP SET
Data Sheet
PMC-2000164
ISSUE 3
ENHANCED TT1™ SWITCH FABRIC
3.6.2 Package Dimensions
This section outlines the mechanical dimensions for the Enhanced Port Processor (EPP) device. The
package is a 624 ceramic ball grid array (CBGA).
NOTE: Drawings are not to scale.
Figure 60. Enhanced Port Processor CBGA Package Dimensions - Top and Side Views
D
D1
E1 E
Top View
Pin A01 corner
A1
A
A2
aaa
Side View
PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
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