PixArt Imaging Inc.
PAS6167
CMOS Image Sensor IC
Recommended Condition For Infrared Reflow
Carefully observe the mounting conditions, recommended temperature profile when
Mounting infrared reflows is show in the figure below.
After mounting on the mother board, it must be dispense epoxy in side of the CSP package.
☉Reflow Profile
RecommendReflow Profile
Melting area
250
200
150
100
50
Pre-heat
0
0
20
40
60
80
100 120 140 160 180 200 220
( Sec )
Time
Recommend Pb-free solder paste vender & type :
1. Almit LFM-48W TM-HP
2. Senju M705-GRN360-K
Programming
Pre-heat
Melting area
rate
170~200oC
90 +/- 30 sec
>220oC 30~50sec
1.5~2.5 oC/sec
with peak temperature 230~245oC
Epoxy
☉Dispense Epoxy
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
19
PixArt Imaging Inc.
E-mail: fae_service@pixart.com.tw
V1.0, 2009/08/12
PIXART [ PIXART IMAGING INC. ]
