PAS302BCW-22S
CMOS Image Sensor IC
8. Package Specification
Dimensions
Package Body Dimension X
Package Body Dimension Y
Package Height
Symbol
A
Min.
4310
4130
740
130
605
395
270
-
Typ.
4335
4155
800
160
640
415
300
800
800
Max.
4360
4180
860
190
675
435
330
-
Unit
µm
µm
µm
µm
µm
µm
µm
µm
µm
µm
µm
B
C
C1
C2
C3
D
J1
J2
S1
S2
Ball Height
Package Body Thickness
Thickness of Glass surface to wafer
Ball Diameter
Pin Pitch X axis
Pin Pitch Y axis
-
-
Edge to Pin Center Distance along X
Edge to Pin Center Distance along Y
537.5
447.5
567.5
477.5
597.5
507.5
Version 2.4, 20 Sep. 2005
PixArt Imaging Inc.
13
E-mail: fae_service@pixart.com.tw
PIXART [ PIXART IMAGING INC. ]
