PAH8011ES Product Datasheet
Low Power Heart Rate Monitor Optical Chip
PixArt Imaging Inc.
4.4.2.2 Recommendation of Stiffener
If use FPC (Flex) board, need add stiffener for FPC (Flex) back-side (at Sensor package area) to enhance the flex strength.
1. Recommended stiffener type: FR4 or stainless steel.
2. Recommended stiffener thickness: minimum 0.4mm for FR4 type, minimum 0.15mm for stainless steel.
4.4.2.3 Recommended use 0.1~0.12mm thickness stencil for SMT process.
1. The stencil thickness selection will need to consider passive component size aside package.
2. In case of the package is surface mounted on FPCB (Flexible Printed Circuit Boards), the overall thickness of cover
layer & adhesive layer is recommenced to be controlled less than 40um.
4.4.2.4 PCB Layout Guidelines
The following guidelines can be refer to Figure 9. PCB Layout Guide.
1. Trace width of VDDM, VDDIO, VDDLED, VDDA, VDDD, VDDAY, LED0, LED1, LED2 traces must be at least 8 mils.
2. Capacitor 0.1µF must be placed close to the chip package.
3. The GND plane of GND of VSSA, VSSD and VSSLED must be layout separately and connected to the PCB’s main GND.
4. If use FPC (Flex) board, recommend VSSLED pin separately to output pin, because of high LED current operation.
Figure 9. PCB Layout Guide
Version 1.1 | 20 Oct 2017 | 31008AEN
PixArt Imaging Inc. http://www.pixart.com
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PIXART [ PIXART IMAGING INC. ]
