PAC7640 Product Datasheet
Enhanced QE Global Shutter Image Sensor
PixArt Imaging Inc.
4.4 Packing Information
4.4.1 Chip Orientation
The chips are packed into 2-inch chip-tray with Pin 1 (A1 pin) orientation is toward the chamfer of chip tray. Refer to Figure
7. IC Orientation.
Figure 7. IC Orientation
4.4.2 Packing Capacity
Table 10. Packing Information
Parameters
Chips per Tray
Trays per Stack
Quantity
81
Unit
piece
Notes
9 x 9. Refer to Figure 7.
Plus a top-cover on top of each stack. Refer to Figure 8
Packaging bag is Aluminum laminated moisture proof bag.
Refer to Figure 9
10
tray
Stacks per Packing Bag
2
stacks
Packing Bags per Packing Box
Max. Chips per Packing Box
5
8100
bag
piece
Refer to Figure 10
Figure 8. Example of One Stack (10 Chip-Trays + 1 Cover-Tray)
Version 1.1 | 11 Sep 2015 | 41002EN
PixArt Imaging Inc. http://www.pixart.com
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