High performance in ultra small packages
Ultra small wafer-level chipscale package
LD68x6 series with ultra small WLCSP package and ultra low-dropout performance
Low-voltage LDO
4-ball WLCSP package
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Ultra-small package
0.47mm
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Ultra-low-dropout performance
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150, 200, and 300 mA output current available
0.76 mm
0.76 mm
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Very good noise performance
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Very low quiescent current
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Thermal shutdown and overcurrent protection
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0.4 mm pitch and high power dissipation
Package options
WLCSP-4
WLCSP-6
CSP
DFN1410-6
DFN1010C-4
DFN1612-8
DFN
DFN1212-6
SOT23
SOT753 (SOT23-5)
Leaded
SOT223
3
4
5
6
8
Standard linear brochure
Pins
7