Philips Semiconductors
Product specification
Fault-tolerant CAN transceiver
TJA1054A
BONDING PAD LOCATIONS
COORDINATES(1)
SYMBOL
PAD
x
y
INH
1
2
106
111
317
168
TXD
RXD
ERR
STB
EN
3
750
111
4
1347
2248
2551
2559
2463
2389
1886
900
111
5
103
6
240
WAKE
RTH
RTL
7
381
8
1443
1840
1809
1698
1698
1356
1241
772
9
VCC
10
11
12
13a
13b
14
CANH
CANL
GND
GND
BAT
401
80
80
105
Note
1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the top aluminium layer (see Fig.8).
handbook, full pagewidth
9
10
12
11
8
13a
13b
1990
µm
TJA1054AU
14
7
1
2
6
3
4
5
x
0
0
y
2730 µm
MGU384
Fig.8 Bonding pad locations.
18
2004 Mar 23
NXP [ NXP ]
