Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
+
5 V
handbook, full pagewidth
120 Ω
47
µF
100
nF
V
CC
3
TXD
1
5
4
TX0
CANH
CANL
7
6
SJA1000
V
ref
CAN
BUS LINE
CAN
TJA1050
CONTROLLER
RXD
RX0
2
8
GND
S
120 Ω
MGS380
Fig.7 Application information.
BONDING PAD LOCATIONS FOR TJA1050U
Table 2 Bonding pad locations
All x/y coordinates represent the position of the centre of
each pad (in µm) with respect to x/y = 0 of the die (see
Fig.8).
COORDINATES
SYMBOL
PAD
x
y
8
7
6
5
handbook, halfpage
TXD
GND
VCC
1
2
3
4
5
6
7
8
103
740.5
886.5
1371.5
1394
1006
542.5
103
103
85
111
RXD
Vref
111
TJA1050U
1094
1111
1111
1097
test pad
CANL
CANH
S
x
0
1
2
3
4
0
MGS381
y
Fig.8 Bonding pad locations.
1999 Sep 27
10
NXP [ NXP ]
