Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
+
5 V
47
µF
100
nF
VCC
TX0
TXD
Vref
3
1
7
CANH
120
Ω
SJA1000
CAN
CONTROLLER
RX0
5
TJA1050
6
CANL
CAN
BUS LINE
RXD
4
2
GND
8
S
120
Ω
MGS380
Fig.7 Application information.
BONDING PAD LOCATIONS FOR TJA1050U
Table 2
Bonding pad locations
All x/y coordinates represent the position of the centre of
each pad (in
µm)
with respect to x/y = 0 of the die (see
Fig.8).
COORDINATES
SYMBOL
PAD
x
y
103
85
111
111
1094
1111
1111
1097
1
2
3
4
5
6
7
8
103
740.5
886.5
1371.5
1394
1006
542.5
103
handbook, halfpage
8
7
6
5
TXD
GND
V
CC
RXD
test pad
TJA1050U
V
ref
CANL
CANH
x
0
0
y
1
2 3
4
MGS381
S
Fig.8 Bonding pad locations.
1999 Sep 27
10
PHILIPS [ NXP SEMICONDUCTORS ]
