Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
BONDING PAD LOCATIONS
COORDINATES(1)
SYMBOL
TXD
PAD
8
7
6
5
handbook, halfpage
x
y
1
2
3
4
5
6
7
8
119.5
648.5
114.5
85
GND
VCC
test pad 1
test pad 2
1214.25
1635.25
1516.5
990.5
114.5
114.5
1275
TJA1040U
RXD
SPLIT
CANL
CANH
STB
1273.75
1273.75
1246
x
0
0
1
2
3
4
530.25
113.75
MBL584
y
Note
The backside of the bare die must be connected to ground.
1. All x/y coordinates represent the position of the centre
of each pad (in µm) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
Fig.9 Bonding pad locations.
2003 Oct 14
11
NXP [ NXP ]
