Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VO(reces)
recessive output voltage
normal mode; VTXD = VCC
;
2
0.5VCC
3
V
no load
standby mode; no load
VTXD = 0 V
−0.1
0
+0.1
V
IO(sc)
short-circuit output current
pin CANH; VCANH = 0 V −40
−70
70
−
−95
100
+2.5
mA
mA
mA
pin CANL; VCANL = 40 V 40
IO(reces)
Vdif(th)
recessive output current
−27 V < VCAN < +32 V
−2.5
differential receiver threshold −12 V < VCANL < +12 V;
voltage −12 V < VCANH < +12 V
normal mode (see Fig.6) 0.5
0.7
0.7
70
0.9
V
standby mode
0.4
50
1.15
100
V
Vhys(dif)
differential receiver hysteresis normal mode;
mV
voltage
−12 V < VCANL < +12 V;
−12 V < VCANH < +12 V
ILI
input leakage current
VCC = 0 V;
VCANH = VCANL = 5 V
−5
15
−3
0
+5
35
+3
µA
kΩ
%
Ri(cm)
Ri(cm)(m)
common-mode input
resistance
standby or normal mode
VCANH = VCANL
25
0
common-mode input
resistance matching
Ri(dif)
Ci(cm)
differential input resistance
standby or normal mode
VTXD = VCC; not tested
25
50
75
20
kΩ
common-mode input
capacitance
−
−
pF
Ci(dif)
differential input capacitance
VTXD = VCC; not tested
normal mode
−
−
10
pF
Timing characteristics; see Fig.8
td(TXD-BUSon) delay TXD to bus active
td(TXD-BUSoff) delay TXD to bus inactive
td(BUSon-RXD) delay bus active to RXD
td(BUSoff-RXD) delay bus inactive to RXD
25
70
110
95
ns
ns
ns
ns
ns
µs
µs
10
50
15
65
115
160
255
1000
5
35
100
−
tPD(TXD-RXD) propagation delay TXD to RXD VSTB = 0 V
tdom(TXD) TXD dominant time-out VTXD = 0 V
tBUS
40
300
0.75
600
1.75
dominant time for wake-up via standby mode
bus
td(stb-norm)
delay standby mode to normal normal mode
mode
5
7.5
10
µs
Thermal shutdown
Tj(sd)
shutdown junction temperature
155
165
180
°C
Note
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 °C
ambient temperature for dies on wafer level, and in addition to this 100% tested at 25 °C ambient temperature for
cased products; unless specified otherwise. For bare dies, all parameters are only guaranteed with the backside of
the die connected to ground.
2003 Oct 14
7
NXP [ NXP ]
