Philips Semiconductors
Product specification
Multistandard vision and sound-IF PLL with
DVB-IF processing
TDA9819
PACKAGE OUTLINES
SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
SOT232-1
D
M
E
A
2
A
A
L
1
c
(e )
w M
e
Z
1
b
1
M
H
b
32
17
pin 1 index
E
1
16
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
A
A
2
max.
(1)
(1)
Z
1
w
UNIT
b
b
c
D
E
e
e
L
M
M
H
1
1
E
min.
max.
1.3
0.8
0.53
0.40
0.32
0.23
29.4
28.5
9.1
8.7
3.2
2.8
10.7
10.2
12.2
10.5
mm
4.7
0.51
3.8
1.778
10.16
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT232-1
1998 Jul 14
34
NXP [ NXP ]
