TDA8931
Philips Semiconductors
Power comparator 1 × 20 W
23. Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
17.3
17.4
17.5
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 26
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 27
Package related soldering information. . . . . . 27
18
19
20
21
22
Revision history . . . . . . . . . . . . . . . . . . . . . . . 29
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 30
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Contact information . . . . . . . . . . . . . . . . . . . . 30
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
8.1
8.2
8.3
8.4
8.5
8.6
8.6.1
8.6.2
8.6.3
8.6.4
8.6.5
8.6.6
Functional description . . . . . . . . . . . . . . . . . . . 5
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Interfacing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Input comparator. . . . . . . . . . . . . . . . . . . . . . . . 5
Half supply voltage input reference (pin HVPI). 5
Half supply voltage capacitor charger (pin HVP) 6
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Overtemperature protection (OTP). . . . . . . . . . 6
Overcurrent protection (OCP). . . . . . . . . . . . . . 6
Overvoltage protection (OVP). . . . . . . . . . . . . . 6
Undervoltage protection (UVP). . . . . . . . . . . . . 7
Supply voltage drop protection . . . . . . . . . . . . . 7
Overdissipation protection (ODP). . . . . . . . . . . 7
9
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal characteristics. . . . . . . . . . . . . . . . . . 11
Static characteristics. . . . . . . . . . . . . . . . . . . . 11
Dynamic characteristics . . . . . . . . . . . . . . . . . 13
10
11
12
13
14
Application information. . . . . . . . . . . . . . . . . . 15
Output power estimation. . . . . . . . . . . . . . . . . 17
Output current limiting. . . . . . . . . . . . . . . . . . . 18
Low pass filter considerations. . . . . . . . . . . . . 18
Thermal behavior (printed-circuit board
14.1
14.2
14.3
14.4
considerations) . . . . . . . . . . . . . . . . . . . . . . . . 18
Thermal layout including vias . . . . . . . . . . . . . 19
Thermal considerations . . . . . . . . . . . . . . . . . 19
Measured performance figures of mono amplifier
with TDA8931 . . . . . . . . . . . . . . . . . . . . . . . . . 21
Curves measured in typical application . . . . . 22
14.4.1
14.4.2
14.5
14.6
15
15.1
16
Test information. . . . . . . . . . . . . . . . . . . . . . . . 24
Quality information . . . . . . . . . . . . . . . . . . . . . 24
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 25
17
17.1
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 26
17.2
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 14 January 2004
Document number: 9397 750 13847
Published in The Netherlands
NXP [ NXP ]
