TDA8920B
Philips Semiconductors
2 × 100 W class-D power amplifier
23. Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
16.3.2
16.3.3
16.4
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 30
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 30
Package related soldering information. . . . . . 31
17
18
19
20
21
22
Revision history . . . . . . . . . . . . . . . . . . . . . . . 32
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 33
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Contact information . . . . . . . . . . . . . . . . . . . . 33
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.4
Functional description . . . . . . . . . . . . . . . . . . . 5
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pulse width modulation frequency . . . . . . . . . . 8
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 8
OverCurrent Protection (OCP) . . . . . . . . . . . . . 8
Window Protection (WP). . . . . . . . . . . . . . . . . 10
Supply voltage protections . . . . . . . . . . . . . . . 10
Differential audio inputs . . . . . . . . . . . . . . . . . 11
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Thermal characteristics. . . . . . . . . . . . . . . . . . 12
Static characteristics. . . . . . . . . . . . . . . . . . . . 12
10
11
12
Dynamic characteristics . . . . . . . . . . . . . . . . . 13
Switching characteristics . . . . . . . . . . . . . . . . 13
Stereo and dual SE application . . . . . . . . . . . 14
Mono BTL application. . . . . . . . . . . . . . . . . . . 15
12.1
12.2
12.3
13
Application information. . . . . . . . . . . . . . . . . . 15
BTL application. . . . . . . . . . . . . . . . . . . . . . . . 15
MODE pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Output power estimation. . . . . . . . . . . . . . . . . 16
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 16
Heatsink requirements . . . . . . . . . . . . . . . . . . 17
Output current limiting. . . . . . . . . . . . . . . . . . . 18
Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 19
Application schematic. . . . . . . . . . . . . . . . . . . 20
Curves measured in reference design . . . . . . 22
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
14
14.1
15
Test information. . . . . . . . . . . . . . . . . . . . . . . . 26
Quality information . . . . . . . . . . . . . . . . . . . . . 26
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 27
16
16.1
16.2
16.2.1
16.2.2
16.3
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Through-hole mount packages. . . . . . . . . . . . 29
Soldering by dipping or by solder wave . . . . . 29
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 29
Surface mount packages . . . . . . . . . . . . . . . . 29
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 29
16.3.1
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 1 October 2004
Document order number: 9397 750 13356
Published in The Netherlands
NXP [ NXP ]
