Philips Semiconductors
Product specification
Dual BTL power driver
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA7073A; TDA7073AT
SOT38-1
D
seating plane
M
E
A
2
A
L
A
1
c
Z
e
b
1
b
16
9
M
H
w
M
(e
1
)
pin 1 index
E
1
8
0
5
scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
A
max.
4.7
0.19
A
1
min.
0.51
0.020
A
2
max.
3.7
0.15
b
1.40
1.14
0.055
0.045
b
1
0.53
0.38
0.021
0.015
c
0.32
0.23
0.013
0.009
D
(1)
21.8
21.4
0.86
0.84
E
(1)
6.48
6.20
0.26
0.24
e
2.54
0.10
e
1
7.62
0.30
L
3.9
3.4
0.15
0.13
M
E
8.25
7.80
0.32
0.31
M
H
9.5
8.3
0.37
0.33
w
0.254
0.01
Z
(1)
max.
2.2
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT38-1
REFERENCES
IEC
050G09
JEDEC
MO-001AE
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
1999 Aug 30
9
PHILIPS [ NXP SEMICONDUCTORS ]
