Philips Semiconductors
Product specification
TDA4555
TDA4556
Multistandard decoder
PACKAGE OUTLINE
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil)
SOT117-1
D
M
E
A
2
A
L
A
1
c
e
w M
Z
b
1
(e )
1
b
M
H
28
15
pin 1 index
E
1
14
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
max.
A
A
Z
(1)
(1)
1
2
UNIT
mm
b
b
c
D
E
e
e
L
M
M
w
1
1
E
H
min.
max.
max.
1.7
1.3
0.53
0.38
0.32
0.23
36.0
35.0
14.1
13.7
3.9
3.4
15.80
15.24
17.15
15.90
5.1
0.51
4.0
2.54
0.10
15.24
0.60
0.25
0.01
1.7
0.013
0.009
0.066
0.051
0.020
0.014
1.41
1.34
0.56
0.54
0.15
0.13
0.62
0.60
0.68
0.63
inches
0.20
0.020
0.16
0.067
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-14
SOT117-1
051G05
MO-015AH
November 1984
10
NXP [ NXP ]
