Philips Semiconductors Linear Products
Product specification
Timer
NE/SA/SE555/SE555C
ABSOLUTE MAXIMUM RATINGS
SYMBOL
Supply voltage
V
CC
P
D
T
A
SE555
NE555, SE555C, SA555
Maximum allowable power
dissipation
1
+18
+16
600
V
V
mW
°C
°C
°C
°C
°C
PARAMETER
RATING
UNIT
Operating ambient temperature range
NE555
SA555
SE555, SE555C
0 to +70
-40 to +85
-55 to +125
-65 to +150
+300
T
STG
T
SOLD
Storage temperature range
Lead soldering temperature (10sec max)
NOTES:
1. The junction temperature must be kept below 125°C for the D package and below 150°C for the FE, N and F packages. At ambient tempera-
tures above 25°C, where this limit would be derated by the following factors:
D package 160°C/W
FE package 150°C/W
N package 100°C/W
F package 105°C/W
August 31, 1994
348
PHILIPS [ NXP SEMICONDUCTORS ]
