PCF8583
NXP Semiconductors
Clock and calendar with 240 x 8-bit RAM
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 5 x 5 x 0.85 mm
SOT662-1
B
A
D
terminal 1
index area
A
A
1
E
c
detail X
C
e
1
y
y
e
b
v
M
M
C
C
A B
C
1
w
6
10
L
11
5
e
e
E
h
2
1
15
terminal 1
index area
20
16
X
D
h
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
(1)
(1)
UNIT
A
b
c
E
e
e
e
2
y
D
D
E
L
v
w
y
1
1
h
1
h
0.05 0.38
0.00 0.23
5.1
4.9
3.25 5.1
2.95 4.9
3.25
2.95
0.75
0.50
mm
0.05
0.1
1
0.2
0.65
2.6
2.6
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-08-08
02-10-22
SOT662-1
- - -
MO-220
- - -
Fig 26. Package outline SOT662-1 (HVQFN20) of PCF8583BS
PCF8583
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 06 — 6 October 2010
28 of 37
NXP [ NXP ]
