Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I
2
C-bus
CONTENTS
1
2
3
4
5
6
6.1
6.2
6.3
6.4
7
7.1
7.2
7.3
7.4
7.5
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
CHARACTERISTICS OF THE I
2
C-BUS
Bit transfer
START and STOP conditions
System configuration
Acknowledge
FUNCTIONAL DESCRIPTION
Quasi-bidirectional I/Os
Addressing
Reading from a port (input mode)
Writing to the port (output mode)
Interrupt
LIMITING VALUES
HANDLING
CHARACTERISTICS
I
2
C-BUS TIMING CHARACTERISTICS
DEVICE PROTECTION
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C COMPONENTS
PCF8575
1999 Apr 07
2
PHILIPS [ NXP SEMICONDUCTORS ]
