PCF8574; PCF8574A
NXP Semiconductors
Remote 8-bit I/O expander for I2C-bus with interrupt
18.4 Package related soldering information
Table 13. Suitability of through-hole mount IC packages for dipping and wave soldering
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP[2]
suitable
-
suitable[1]
not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
PCF8574_PCF8574A
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Product data sheet
Rev. 5 — 27 May 2013
25 of 33
NXP [ NXP ]
