NXP Semiconductors
PCF8574; PCF8574A
Remote 8-bit I/O expander for I
2
C-bus with interrupt
Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
Packages offered: DIP16, SO16, SSOP20
3. Applications
LED signs and displays
Servers
Key pads
Industrial control
Medical equipment
PLC
Cellular telephones
Mobile devices
Gaming machines
Instrumentation and test measurement
4. Ordering information
Table 1.
Ordering information
Topside mark
PCF8574P
PCF8574AP
PCF8574T
PCF8574AT
8574TS
8574A
SSOP20
plastic shrink small outline package; 20 leads;
body width 4.4 mm
SOT266-1
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
Package
Name
PCF8574P
PCF8574AP
PCF8574T/3
PCF8574AT/3
PCF8574TS/3
PCF8574ATS/3
DIP16
Description
plastic dual in-line package; 16 leads (300 mil)
Version
SOT38-4
Type number
4.1 Ordering options
Table 2.
Ordering options
Orderable
part number
PCF8574P,112
PCF8574AP,112
PCF8574T/3,512
PCF8574T/3,518
PCF8574AT/3
PCF8574AT/3,512
PCF8574AT/3,518
Package Packing method
Minimum
order
quantity
1000
1000
1920
1000
1920
1000
Temperature range
Type number
PCF8574P
PCF8574AP
PCF8574T/3
DIP16
DIP16
SO16
SO16
SO16
SO16
Standard marking
* IC’s tube - DSC bulk pack
Standard marking
* IC’s tube - DSC bulk pack
Standard marking
* tube dry pack
Reel 13” Q1/T1
*standard mark SMD dry pack
Standard marking
* tube dry pack
Reel 13” Q1/T1
*standard mark SMD dry pack
T
amb
=
40 C
to +85
C
T
amb
=
40 C
to +85
C
T
amb
=
40 C
to +85
C
T
amb
=
40 C
to +85
C
T
amb
=
40 C
to +85
C
T
amb
=
40 C
to +85
C
PCF8574_PCF8574A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 27 May 2013
2 of 33
PHILIPS [ NXP SEMICONDUCTORS ]
