PCF8574; PCF8574A
NXP Semiconductors
Remote 8-bit I/O expander for I2C-bus with interrupt
19. Soldering: PCB footprints
Footprint information for reflow soldering of SO16 package
SOT162-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
By Ay
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 P2 Ay
By
C
D1
D2
Gx
Gy
Hx
Hy
1.270 1.320 11.200 6.400 2.400 0.700 0.800 10.040 8.600 11.900 11.450
sot162-1_fr
Fig 22. PCB footprint for SOT162-1 (SO16); reflow soldering
PCF8574_PCF8574A
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Product data sheet
Rev. 5 — 27 May 2013
26 of 33
NXP [ NXP ]
