PCA82C251T 参数 Datasheet PDF下载

Philips Semiconductors

Product specification

CAN transceiver for 24 V systems

BONDING PAD LOCATIONS

PCA82C251

COORDINATES

(1)

SYMBOL

TXD

GND

V

CC

RXD

V

ref

CANL

CANH

Rs

Note

1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of

the die (x/y = 0).

PAD

x

1

2

3

4

5

6

7

8

196

1080

1567

2644

2644

1490

748

200

y

137

137

137

137

1644

1644

1644

1610

CANH

8

7

6

1.78

mm

PCA82C251U

1

TXD

x

0

2

GND

3

VCC

0

y

RXD

Vref

5

4

handbook, full pagewidth

CANL

Rs

2.84 mm

MGL944

Fig.10 Bonding pad locations.

2000 Jan 13

11