PHILIPS SEMICONDUCTORS, INC. A SUBSIDIARY OF
PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
PREPARED BY:
Dresser
W
9226
4645
60
ENGINEER CHANGE NOTICE
850-0007
FORM A 02/95
OF
SVL
PAGE
Nov 27, 1995
ECN NUMBER & DATE
LAST NAME
PERMANENT
X
APPROVAL
DATE:
EXPIRATION
DATE:
PRODUCT GROUP:
PART NUMBER
INIT
DEPT EXT
BIN#
DATE
PLANT
IMMEDIATE
TEMPORARY
MASTER SIGNOFF:
YES:
NO:
AFTER-HOURS
INITIALS:
ECN CONTINUATION ATTACHED:
YES:
NO:
Communication Products Group
ROUTER
:
DATE
ALPHA
PKG/REV
BASIC DIE/REV
CUSTOMER PART #/REV
DOCUMENT TITLE:
See description below
DOCUMENT TYPE:
Data Sheet
DOCUMENT NUMBER:
853-
REV:
DESCRIPTION OF CHANGE: INCLUDE FROM/TO INFO WHERE APPROPRIATE
LM2901
. . . . . . 853-0930 13721 . . . . . 94 Aug 31
LM2902
. . . . . . 853-0929 13721 . . . . . 94 Aug 31
LM2903
. . . . . . 853-0932 13721 . . . . . 94 Aug 31
LM2904
. . . . . . 853-1241 13721 . . . . . 94 Aug 31
All data sheets reflect change from 85°C to 125°C.
EFFECT:
( )MAJOR
( )MINOR
PROVIDE CPCN STATUS, JUSTIFICATION FOR THE
CHANGE AND AN EXPLANATION OF EFFECT
OIDS/DOCUMENTS AFFECTED:
PRIME
PDYM
CDDB
ESORT
DDDB
EMCR
FAB XREF
PMF/PDDB
KEY SPONSOR:
CO-SPONSORS:
DEPT#
ECN
DISTRIBUTION:
DEPT# DEPT# DEPT#
FPOID
APL
FT/PA
FT FLOW
MPO
X
PROBE DIAGRAM
BONDING DIAGRAM
SCHEMATIC
TABLE
OTHER
853-
SIGNATURE
MISCELLANEOUS
DISTRIBUTION:
DATE
EXT/USER ID
DEPT# DEPT# DEPT#
FT
PA
PACK
FG
MATL
STRS OTHER
MATERIAL DISPOSITION:
FAB ESORT DS ASSY SEAL SYMB M/V
USE AS IS
REWORK
SCRAP
PHILIPS [ NXP SEMICONDUCTORS ]
