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LPC2138FBD64,151 参数 Datasheet PDF下载

LPC2138FBD64,151图片预览
型号: LPC2138FBD64,151
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内容描述: [LPC2131/32/34/36/38 - Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC QFP 64-Pin]
分类和应用: 时钟PC微控制器外围集成电路
文件页数/大小: 45 页 / 318 K
品牌: NXP [ NXP ]
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LPC2131/32/34/36/38  
NXP Semiconductors  
Single-chip 16/32-bit microcontrollers  
One (LPC2131/32) or two (LPC2134/36/38) 8-channel 10-bit ADCs provide a total of  
up to 16 analog inputs, with conversion times as low as 2.44 s per channel.  
Single 10-bit DAC provides variable analog output (LPC2132/34/36/38).  
Two 32-bit timers/external event counters (with four capture and four compare  
channels each), PWM unit (six outputs) and watchdog.  
Low power Real-time clock with independent power and dedicated 32 kHz clock input.  
Multiple serial interfaces including two UARTs (16C550), two Fast I2C-bus (400 kbit/s),  
SPI and SSP with buffering and variable data length capabilities.  
Vectored interrupt controller with configurable priorities and vector addresses.  
Up to forty-seven 5 V tolerant general purpose I/O pins in tiny LQFP64 or HVQFN  
package.  
Up to nine edge or level sensitive external interrupt pins available.  
60 MHz maximum CPU clock available from programmable on-chip PLL with settling  
time of 100 s.  
On-chip integrated oscillator operates with external crystal in range of 1 MHz to  
30 MHz and with external oscillator up to 50 MHz.  
Power saving modes include Idle and Power-down.  
Individual enable/disable of peripheral functions as well as peripheral clock scaling  
down for additional power optimization.  
Processor wake-up from Power-down mode via external interrupt or BOD.  
Single power supply chip with POR and BOD circuits:  
CPU operating voltage range of 3.0 V to 3.6 V (3.3 V 10 %) with 5 V tolerant I/O  
pads.  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
LPC2131FBD64/01 LQFP64  
plastic low profile quad flat package; 64 leads;  
SOT314-2  
body 10 10 1.4 mm  
LPC2132FBD64/01 LQFP64  
plastic low profile quad flat package; 64 leads;  
body 10 10 1.4 mm  
SOT314-2  
SOT804-2  
LPC2132FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat  
package; no leads; 64 terminals; body  
9 9 0.85 mm  
LPC2134FBD64/01 LQFP64  
LPC2136FBD64/01 LQFP64  
LPC2138FBD64/01 LQFP64  
plastic low profile quad flat package; 64 leads;  
body 10 10 1.4 mm  
SOT314-2  
SOT314-2  
SOT314-2  
SOT804-2  
plastic low profile quad flat package; 64 leads;  
body 10 10 1.4 mm  
plastic low profile quad flat package; 64 leads;  
body 10 10 1.4 mm  
LPC2138FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat  
package; no leads; 64 terminals; body  
9 9 0.85 mm  
LPC2131_32_34_36_38  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5.1 — 29 July 2011  
2 of 45  
 
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