NXP Semiconductors
HEF40106B-Q100
Hex inverting Schmitt trigger
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
E
v
M
A
Z
14
8
Q
A
2
pin 1 index
A
1
θ
L
p
L
(A
3
)
A
1
e
b
p
7
w
M
detail X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
1.1
A
1
0.15
0.05
A
2
0.95
0.80
A
3
0.25
b
p
0.30
0.19
c
0.2
0.1
D
(1)
5.1
4.9
E
(2)
4.5
4.3
e
0.65
H
E
6.6
6.2
L
1
L
p
0.75
0.50
Q
0.4
0.3
v
0.2
w
0.13
y
0.1
Z
(1)
0.72
0.38
θ
8
o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
MO-153
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 13. Package outline SOT402-1 (TSSOP14)
HEF40106B_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 7 August 2012
11 of 15
PHILIPS [ NXP SEMICONDUCTORS ]
