Philips Semiconductors
Product specification
CATV amplifier module
BGY588N
PACKAGE OUTLINE
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads
SOT115J
D
E
Z
p
A
2
1
2
3
5
7
8
9
A
L
F
S
W
e
b
M
w
y
c
e
1
d
q
y
M
B
2
U
Q
2
B
q
M
B
1
y
M
B
p
U
q
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
U
A
d
max.
A
max.
D
max.
E
max.
L
min.
Q
max.
Z
max.
1
2
UNIT
e
e
p
q
W
w
y
b
c
F
q
q
S
U
1
1
2
2
max.
max.
4.15
3.85
0.51
0.38
6-32
UNC
mm 20.8 9.1
0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8
2.4 38.1 25.4 10.2 4.2 44.75
8
0.25 0.1 3.8
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
99-02-06
SOT115J
2000 Feb 14
4
NXP [ NXP ]
