BC846/BC546 series
NXP Semiconductors
65 V, 100 mA NPN general-purpose transistors
2.65
0.75
1.30
1.325
solder lands
2
solder paste
0.50
3
0.60
(3×)
2.35 0.85
1.90
(3×)
solder resist
occupied area
1
Dimensions in mm
0.55
(3×)
msa429
2.40
Fig 17. Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
2
3
3.65 2.10
2.70
solder lands
0.90
(2×)
solder resist
1
occupied area
Dimensions in mm
msa419
preferred transport direction during soldering
Fig 18. Wave soldering footprint SOT323 (SC-70)
2.2
0.6
1.1
0.7
2
3
2.0 0.85
1.5
0.5
(3x)
1
0.6
(3x)
msa438
1.9
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
Fig 19. Reflow soldering footprint SOT416 (SC-75)
BC846_BC546_SER_7
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 — 17 November 2009
11 of 14
NXP [ NXP ]
