BAV99 series
NXP Semiconductors
High-speed switching diodes
2.65
1.85
1.325
solder lands
solder resist
2
3
0.6
(3×)
solder paste
occupied area
1.3
2.35
0.5
(3×)
1
Dimensions in mm
0.55
(3×)
sot323_fr
Fig 14. Reflow soldering footprint BAV99W (SOT323/SC-70)
4.6
2.575
1.425
(3×)
solder lands
solder resist
occupied area
1.8
3.65 2.1
Dimensions in mm
preferred transport
direction during soldering
09
(2×)
sot323_fw
Fig 15. Wave soldering footprint BAV99W (SOT323/SC-70)
BAV99_SER
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 8 — 18 November 2010
10 of 14
NXP [ NXP ]
