BAV70 series
NXP Semiconductors
High-speed switching diodes
2.65
0.60
(2×)
0.40
2.35
0.90 2.10
(2×)
solder lands
solder paste
0.50
(4×)
solder resist
0.50
(4×)
occupied area
Dimensions in mm
1.20
2.40
sot363
Fig 15. Reflow soldering footprint BAV70S (SOT363/SC-88)
5.25
0.30 1.00 4.00
4.50
solder lands
1.15
3.75
solder resist
occupied area
transport direction during soldering
Dimensions in mm
sot363
Fig 16. Wave soldering footprint BAV70S (SOT363/SC-88)
BAV70_SER_7
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 27 November 2007
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