NXP Semiconductors
BAV23 series
Dual high-voltage switching diodes
3.25
0.6
(3×)
0.5
(3×)
1.9
solder lands
solder resist
2
3
solder paste
occupied area
0.7 0.6
Dimensions in mm
0.7 0.6
(3×) (3×)
0.75
0.9
1
0.95
sot143b_fr
Fig 11. Reflow soldering footprint SOT143B
4.45
2.2
1.2
(3×)
1.425
(3×)
solder lands
solder resist
4.6
2.575
occupied area
Dimensions in mm
1.425
preferred transport direction during soldering
1
1.2
sot143b_fw
Fig 12. Wave soldering footprint SOT143B
BAV23_SER_7
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 07 — 19 March 2010
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