NXP Semiconductors
BAS16 series
High-speed switching diodes
Table 6.
Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per device
T
j
T
amb
T
stg
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Parameter
junction temperature
ambient temperature
storage temperature
Conditions
Min
-
−65
−65
Max
150
+150
+150
Unit
°C
°C
°C
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB with 60
µm
copper strip line.
Single diode loaded.
T
j
= 25
°C
prior to surge.
Reflow soldering is the only recommended soldering method.
Soldering point of cathode tab.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
Soldering points at pins 4, 5 and 6.
6. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
BAS16
BAS16H
BAS16J
BAS16L
BAS16VV
Conditions
in free air
Min
Typ
Max
Unit
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
500
330
150
230
500
700
410
625
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
BAS16W
R
th(j-t)
thermal resistance from
junction to tie-point
BAS16
BAS16W
-
-
-
-
330
300
K/W
K/W
BAS16_SER_5
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 25 August 2008
5 of 20
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