Philips Semiconductors
Product specification
CAN controller interface
PCA82C250
BONDING PAD LOCATIONS
SYMBOL
COORDINATES(1)
PAD
x
y
TXD
GND
VCC
1
2
3
4
5
6
7
8
196
1280
1767
2588
2594
1689
948
135
135
135
RXD
Vref
135
1640
1640
1640
1640
CANL
CANH
Rs
196
Note
1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of
the die (x/y = 0).
handbook, full pagewidth
5
8
7
6
1.78
mm
PCA82C250U
1
2
3
4
0
x
0
y
MGL945
2.79 mm
Fig.12 Bonding pad locations.
2000 Jan 13
14
NXP [ NXP ]
