74LVC16244A; 74LVCH16244A
NXP Semiconductors
16-bit buffer/line driver; 5 V input/output tolerant; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
Temperature range Package
Name
Description
Version
74LVC16244ADL
74LVCH16244ADL
74LVC16244ADGG
74LVCH16244ADGG
74LVC16244AEV
74LVCH16244AEV
74LVC16244ABQ
74LVCH16244ABQ
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
SSOP48
plastic shrink small outline package; 48 leads;
body width 7.5 mm
SOT370-1
TSSOP48
VFBGA56
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
SOT362-1
plastic very thin fine-pitch ball grid array package; SOT702-1
56 balls; body 4.5 × 7 × 0.65 mm
HUQFN60U plastic thermal enhanced ultra thin quad flat
package; no leads; 60 terminals; UTLP based;
body 4 x 6 x 0.55 mm
SOT1025-1
4. Functional diagram
1
1A0
1A1
1A2
1A3
1OE
2A0
2A1
2A2
2A3
2OE
1Y0
1Y1
1Y2
1Y3
3A0
3A1
3A2
3A3
3OE
4A0
4A1
4A2
4A3
4OE
3Y0
1OE
2OE
3OE
4OE
EN1
EN2
EN3
EN4
47
46
44
43
1
2
3
5
6
36
35
33
32
25
30
29
27
26
24
13
14
16
17
48
25
24
3Y1
3Y2
3Y3
47
46
44
43
41
40
38
37
36
35
33
32
30
29
27
26
2
3
1A0
1A1
1A2
1A3
2A0
2A1
2A2
2A3
3A0
3A1
3A2
3A3
4A0
4A1
4A2
4A3
1
1
1
1
1
2
3
4
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
3Y0
3Y1
3Y2
3Y3
4Y0
4Y1
4Y2
4Y3
5
6
8
9
11
12
13
14
16
17
19
20
22
23
2Y0
2Y1
2Y2
2Y3
4Y0
4Y1
4Y2
4Y3
41
40
38
37
48
8
9
19
20
22
23
11
12
001aae506
001aae231
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
Fig 1. Logic symbol
Fig 2. IEC logic symbol
74LVC_LVCH16244A_8
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 08 — 17 November 2008
2 of 18
NXP [ NXP ]
