Philips Semiconductors
Product specification
Programmable divide-by-n counter
74HC/HCT4059
PACKAGE OUTLINES
DIP24: plastic dual in-line package; 24 leads (300 mil)
SOT222-1
D
M
E
A
2
A
L
A
1
c
w M
e
Z
b
1
(e )
1
M
H
b
24
13
pin 1 index
E
1
12
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
min.
max.
max.
1.63
1.14
0.56
0.43
0.36
0.25
31.9
31.5
6.73
6.48
3.51
3.05
8.13
7.62
10.03
7.62
4.70
0.38
3.94
2.54
0.100
7.62
0.25
0.01
2.05
0.064
0.045
0.022
0.017
0.014
0.010
1.256
1.240
0.265
0.255
0.138
0.120
0.32
0.30
0.395
0.300
inches
0.185
0.015
0.155
0.300
0.081
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-03-11
SOT222-1
MS-001AF
1998 Jul 08
16
NXP [ NXP ]
